Packaging Design Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE: 

A design engineer who has experiences on substrate layout design, ballmap assignment, high speed interface (PAM-4 112Gbps/high speed DDR)  design practices, advanced PKG (2.5D/3D PKG) design knowledge, low-cost PKG solution design including FCCSP, InFO, and thin-core design.         

KEY RESPONSIBILITIES:  

• Work with internal SIPI team to come up a valuable/cost-effective/high performance PKG design.
• Work with product planning team to propose a competitive PKG solutions to client for customized devices.
• Do PKG feasibility study including layout implementation and ballmap practices.
• Evaluate and develop aggressive design rule for low-cost PKG solution. 

PREFERRED EXPERIENCE:  

• Familiar tools: APD, Auto-cad, Calibre, Microsoft office.

ACADEMIC CREDENTIALS:  

• Bachelors or Masters degree in computer engineering/Electrical Engineering 

#LI-SH2
#LI-Hybrid

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE: 

A design engineer who has experiences on substrate layout design, ballmap assignment, high speed interface (PAM-4 112Gbps/high speed DDR)  design practices, advanced PKG (2.5D/3D PKG) design knowledge, low-cost PKG solution design including FCCSP, InFO, and thin-core design.         

KEY RESPONSIBILITIES:  

• Work with internal SIPI team to come up a valuable/cost-effective/high performance PKG design.
• Work with product planning team to propose a competitive PKG solutions to client for customized devices.
• Do PKG feasibility study including layout implementation and ballmap practices.
• Evaluate and develop aggressive design rule for low-cost PKG solution. 

PREFERRED EXPERIENCE:  

• Familiar tools: APD, Auto-cad, Calibre, Microsoft office.

ACADEMIC CREDENTIALS:  

• Bachelors or Masters degree in computer engineering/Electrical Engineering 

#LI-SH2
#LI-Hybrid